TSMC looks set to hit Intel where it hurts, announcing its A16 node with 'Super Power Rail' backside power delivery

TSMC Wafer
(Image credit: Taiwan Semiconductor Manufacturing Co., Ltd.)

While Intel has been busy making bets on its 18A node as part of its accelerated roadmap towards chip making dominance, TSMC appears to have been beavering away in the background to undercut it. 

It's just announced its own "angstrom-class" process, A16, which thanks to its backside power delivery implementation looks set to not only offer significantly improved performance compared to its upcoming NP2 process, but also improve energy efficiency, too. Intel has its own competing backside power delivery tech, PowerVia. While Intel says it will begin producing chips on 18A next year, it doesn't expect to start producing large volumes of chips on the 18A node until 2027.

The A16 process will make use of gate-all-around (GAAFET) nanosheet transistors alongside a backside power rail method called "Super Power Rail", which should not only improve power delivery but also increase transistor density (via Anandtech). Not only that, but TSMC has also indicated that it won't be using ASML's High NA EUV photolithography machines, which strikes as a bit of a "yah boo sucks to be you" given that Intel's been proudly showing off its new machine very recently. 

Your next upgrade

Nvidia RTX 4070 and RTX 3080 Founders Edition graphics cards

(Image credit: Future)

Best CPU for gaming: The top chips from Intel and AMD.
Best gaming motherboard: The right boards.
Best graphics card: Your perfect pixel-pusher awaits.
Best SSD for gaming: Get into the game ahead of the rest.

It's a difficult game, the chip manufacturing business, and this new node announcement is unlikely to raise Intel's spirits in regards to its future plans.

Now then, we've all had a drink. Let's just agree that we all want some faster, more efficient silicon with better power efficiency, and that there's plenty of room for everyone in the harmonious world of tech. No? Well then, the battle for dominance continues, I guess, and while TSMC continues to have a much stronger hand, we'll be waiting with baited breath to see who swings next.

Andy Edser
Hardware Writer

Andy built his first gaming PC at the tender age of 12, when IDE cables were a thing and high resolution wasn't—and he hasn't stopped since. Now working as a hardware writer for PC Gamer, Andy spends his time jumping around the world attending product launches and trade shows, all the while reviewing every bit of PC gaming hardware he can get his hands on. You name it, if it's interesting hardware he'll write words about it, with opinions and everything.